Leaded Solder Tin Paste – 183℃ circuit board SMT/BGA soldering

$12.95

A new type of solder material that comes with SMT.
A complex system made of paste of solder powder, flux, and other additives.
At normal temperature, solder tin paste has a certain viscosity, the electronic component can be initially adhered to a predetermined position.
At the soldering temperature, the soldered component and the printed circuit pad are soldered together (Permanent connection) with the evaporation of the solvent and some additives.

Availability: 3 in stock

Leaded Solder Tin Paste – 183℃ – high-precision circuit board SMT/BGA soldering

Model XG Series Solder Tin Paste

1 X 35g TUB – that’s enough for a while.

Material Sn-Pb alloy
Melting Point 183℃
Certification RoHS compliant
Wettability Bright & Even solder joints
Printability Eliminate missing pits and knots during printing
Feature Reflow does not produce tin beads and tin bridge
Service Life Can use continuously for more than ten hours at room temperature without producing tin beads
Application Radiator module welding & LED welding & High frequency welding

Unique chemical formula provides excellent wetting, to ensure high reliability. Adapted to the mobile phone repair industry, computer digital service industries and high-precision circuit board soldering SMT/BGA soldering processes.

PCB/BGA Dedicated – Viscosity is moderate, there is almost no patch collapse.

Storage time up to 12 months in a refrigerated environment. Unique high-quality solder tin paste (the best configuration ingredients: Sn63/Pb37) make the adhesion long-lasting, it is not easy to dry, and the viscosity time is up to 48 hours.

What is solder tin paste?

A new type of solder material that comes with SMT.
A complex system made of paste of solder powder, flux, and other additives.
At normal temperature, solder tin paste has a certain viscosity, the electronic component can be initially adhered to a predetermined position.
At the soldering temperature, the soldered component and the printed circuit pad are soldered together (Permanent connection) with the evaporation of the solvent and some additives.

Instructions:

Before the opening, the temperature of the solder paste should be raised to the ambient temperature (25℃), and the temperature return time should be about 3-4 hours. It is forbidden to use other heaters to raise the temperature instantaneously.
After the solder paste is opened, it is recommended to use it within 24 hours at room temperature.
Placed in the air for a long time, the solder paste will become a tin block due to moisture absorption.
The indoor temperature should be controlled at 22-28℃, and the humidity RH30-60% is the best working environment.

Use industrial alcohol or industrial cleaner to clean up mistakes.

Preservation:
The solder paste should be kept at 0-10℃, used within12 months, should not be placed in the sun.

Precautions:

Use only with adequate Ventilation.
The solder paste contains organic solvent. Avoid repeated contact with skin. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with water.
In order to be cautious, in the operation, the smoke released by the solvent during operation should be avoided as much as possible, and the skin and mucous membrane tissues should not be contacted for too long. Avoid repeated breathing of vapor.
Avoid contacting with eyes.
Keep away from children.

 

  • Particle Size: 25-48μm
  • Type: Soldering tin paste
  • Melting Point: 183℃
  • Sn Content: 63.0%
  • Pb Content: 37.0%
  • Feature: No-clean
  • Stored Temperature: 0-10℃
  • Application: For industrial use only
  • Gross Weight: About 16.0-60.0g / pcs

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